 The Integrated Cooling Engine included with the current Shuttle XPCs improves on the previous XPC I.C.E. design. The I.C.E. module’s thermal resistance has been decreased to an amazing 0.16º C/W (1). This is less half the thermal resistance of first generation Shuttle XPCs and only one-third that of Intel’s BTX standard. Further, the heat exchange surface area has been increased as have the number of radiator fins. Lastly, it sports a generous 92mm cooling fan to quietly push more air out the back of the case.
I.C.E.
Generation |
Thermal
capacity |
Fan
diameter |
Fan
connector |
max.
Airflow (3) |
termal
resistance (1) |
| 1st Gen. |
80 W |
80 mm |
3 pins |
25 CFM |
0.33 °C/W |
| 2nd Gen. |
100 W |
80 mm |
3 pins |
35 CFM |
0.22 °C/W |
| 3rd Gen. |
120 W + |
92 mm |
4 pins (2) |
50 CFM |
0.16 °C/W |
(1) 0.22 °C/W means a 22 degrees higher temperature compared to the environment with a heat dissipation of 100W.
(2) 4 pin fan connector for improved RPM (revolutions per minute) speed control by PWM (pulse width modulation)
(3) CFM means "cubic feet per minute". Cubic feet is a unit of measurement for volume. One cubic meter equals 35.3 cubic feet.
Evolution
These 4-pin header for all RPM controlled fans are standard on current Shuttle XPCs. |