FAQs


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Adhesive thermal silicone gel on P4 CPU die?

Adhesive thermal silicone gel such as Shin-Etsu Silicone will set after about 6 hours and form a strong bond between the heatsink and CPU die or other applied surfaces (eg. memory module, chipsets). This type of adhesive thermal compound is strongly not recommended to use on P4 Socket 423/478 CPU die.

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2008